| Honeywell
supplies wafer foundry services to customers
seeking moderate volumes and/or special technical
requirements. |
| |
| Honeywell
has a complete IC design environment for implementing
your integrated circuit designs. We offer
proven design methodologies and a variety
of computer-aided design tools for gate array,
standard cell and custom IC design creation.
Our full contract design service includes
the following options: |
| |
- Design
Conversion: Several design tools are capable
of reading a number of net list formats
including TDL, EDIF NDL and VHDL.
-
Customer Design: We will provide its Mentor
based tool kit and synthesis libraries.
-
Complete Design: We will work with you
to ensure full understanding of your functional
specifications, then convert those into
the appropriate IC design.
|
| We
will take the time to ensure a full understanding
of your requirements and expectations. |
| |
| Wafer
Manufacturing |
| Integrated
circuit wafer manufacturing services are offered
for submicron technologies including digital
Silicon On Insulator (SOI) CMOS, mixed signal
SOI CMOS, RF/Microwave SOI CMOS, High Temperature
SOI CMOS. Magnetic/permalloy and thin film
resistor custom manufacturing is also available.
We utilize computerized MRP II shop floor
control and engineering data systems, as well
as on-line real time Statistical Process Control,
in line defect monitoring, and technology
characterization vehicles to control and monitor
our processes. Our team of highly skilled
process and technology engineers will enthusiastically
support your program. |
|
|
| |
| Electrical
Test/Burn-In |
| Using
advanced test hardware and software tools,
we provide cost effective testing of your
products. Our test data management system
combines the hardware for data storage, mapping,
analysis and customized reporting.
|
| |
| In
addition to digital and analog testing, we
have laser trimming, Aracor radiation testing
systems and thermostream temperature testing
capability. Burn-in services include static
and dynamic capability, custom board design
and fabrication. |
| |
| Packaging |
| Utilizing
the latest technologies, our IC assembly facility
offers a full range of services from package
design to assembly and mechanical screening.
Our assembly facility complies to the specifications
of MIL-STD-883 for both Class "S" and "B"
levels. We have received the Defense Electronic
Supply Center's (DESC) certification to MIL-PHF-38535
for both "Q" and "V" level assembly and mechanical
screening. Custom package design, assembly
and screening for both small and large volumes
are easily accommodated in our Class 100 clean
room. The assembly operations Total Quality
Management (TQM) approach utilizes SPC, in-process
controls and Design Of Experiments that results
in a high-yield, fast-turn assembly process.
|
| |
| Customers
may select from a variety of standard assembly
flows or options for a fully-customized assembly
flow. Fast turns for proof of design or development
product runs are available. |
| |
| A
wide variety of standard package types are
available. Custom package design is available
upon request. |
| |
| Customers |
| Forming
close partnerships with customers is key to
foundry business success. Customers are routinely
involved in product development and strategic
planning. Customers are given complete access
to our people and a program manager is assigned
to act as the customer's primary advocate.
SSEC is certified by R.M.O.S.I.S. as a foundry
for their design consolidation service, including
classified work. |
