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Radiation Hardened Electronics and Radiation Technology |
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Honeywell's radiation hardened electronics and radiation technology provide military aerospace system designers a strategically hardened family of products to reduce risks in space and ensure mission success. From communications in space to ground network systems, Honeywell's family of memories and Application Specific Integrated Circuits (ASICs) are developed to guarantee systems perform optimally in radiation-prone environments.
Honeywell is forging a new path in strategic systems by introducing 150-nanometer scale radiation hardened Integrated Circuits (ICs) and System On a Chip (SoC) featuring 8 million gates. By closing the technology gap between strategic and commercial electronics, Honeywell is significantly improving IC performance while decreasing size and power usage.
Honeywell offers a wide variety of services in engineering, design, fabrication, and post production services to meet nearly all requirements for commercial space and military aerospace programs. Customers provide us with a challenge—and we find the most effective path to success.
Military and aerospace system leaders benefit from Honeywell's breadth of service and expertise to support any level of complexity and set of program requirements. In addition to offering an unwavering commitment to our customers, Honeywell helps military aerospace suppliers develop breakthrough solutions with: |
 | | A broad family of 150-nanometer to 800-nanometer gate-array and standard-cell ASICs | | | High-speed, low-power SRAMs, including space-saving, complex MultiChip Modules | | | SERDES (SERializerDESerializer) technology to enhance digital communication | | | System On Chip (SoC) to further increase speed, and reduce system power consumption | | | Optional services including testing and state-of-the-art packaging |
| Radiation Hardened Solutions | |  | Honeywell's Silicon On Insulator (SOI) CMOS products are designed to endure harsh elements in space, including total dose levels exceeding 1 Mrad (Si), dose rates exceeding 1012 rads(SiO2)/s and SEU of 10-11 errors/bit-day. |
| Quality & Reliability | |  | Honeywell adheres to strict high quality practices to ensure every lot, wafer and part is tested and monitored to consistently prevent failures. |
| FPGA Replacement Services | |  | As part of Honeywell's commitment to help technology development teams meet program reliability and mission requirements, Honeywell has developed a cost-effective validated path to convert or replace field programmable gate arrays (FPGAs) with our highly reliable application specific integrated circuits (ASICs). |
| Design Services | |  | Honeywell provides advanced design expertise and customer support needed to ensure success of your strategic ICs, from existing, standard designs to next-generation, high-density standard cell and gate array ASICs. |
| Test & Packaging | |  | Using advanced test hardware and software tools, we provide cost effective testing of your products. Our test data management system combines the hardware for data storage, mapping, analysis and customized reporting. |
| Technologies | |  | Honeywell has been in the forefront of radiation hardened integrated circuit (IC) technologies for decades, providing system developers with breakthrough solutions and successes. Today, Honeywell continues to introduce “industry first” technologies as well as optimize mature technologies to create stable, cutting-edge values to meet high-demand requirements |
| Business Partners | |  | Honeywell consistently seeks innovative ways to accelerate access to advanced technologies and ease the transition to next-generation radiation hardened and radiation tolerant electronics. By teaming up with industry leaders that complement Honeywell's integrity of quality, Honeywell is creating an efficient, successful path to silicon. |
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