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News Archive
Honeywell Acquires Point Research Corporation Pioneer in Dead Reckoning and High End Compassing Including Navigation in Difficult Environments
New Honeywell Wafer Foundry Will Produce Industry's First 150-Nanometer Radiation Hardened Semiconductors
Honeywell Introduces Serial, Optical Technologies for Next-Generation Military Aerospace Communication Systems
Frost & Sullivan acknowledges Honeywell SSEC's Superiority in Magnetic Sensor Components Market
Honeywell Announces Macrocells For Military, Civilian Global Positioning Systems
Honeywell DSES Parts Make First Trip To Saturn rad-hard ASICs.
Honeywell and Synopsys help ASIC developers go One Step Beyond with concept-to-parts solutions for next generation rad-hard ASICs.
Honeywell demonstrates commitment to the environment by becoming ISO-14001 certified.
Click here
to view the certificate.
Honeywell And Synopsys Will Co-Develop Design Flow For Next-Generation Radiation-Hardened Integrated Circuits
.
Honeywell and Motorola, Inc. have signed a technology transfer and licensing agreement.
Motorola to provide Honeywell access to its magneto-resistive random access memory (MRAM) non-volatile memory chip technology.
View Honeywell's cover feature in
Wireless Systems Design
Nov/Dec issue: "Radio On A Chip Unwires Electronics".
Product Announcement:
Honeywell Introduces Radio Transceiver Demonstration Kit To Help Reduce Radio Design Cycle.
View September issue of Microwave Journal features a technical article about our radio on a chip transceiver "
RADIO ON A CHIP FOR AFFORDABLE WIRELESS NETWORKING
".
Honeywell to Develop High Temperature Electronics for U.S. Department of Energy Deep Trek Program.
$6 Million DOE Funding Will Facilitate High-Tech Systems For Exploration of Untapped Natural Gas and Oil Reserves
Product Announcement:
Honeywell introduces the
HMC6352
, a 2-Axis Digital Integrated Compass Solution that combines a two-axis Magnetoresistive magnetic field sensor from Honeywell, with the required analog and digital support circuits for heading computation.
Wireless Design & Development magazine awarded Honeywell with the 2002 Technology Award as the
Best Of The Best product of the year
. Honeywell's radio module, was selected by the publication's panel of Advisory Board, editors and readers from among more than 1,500 new products for being technologically innovative, useful and unique in design.
Honeywell International has signed an agreement with Cypress Semiconductor Corporation
to jointly develop a new technology for integrated circuits (ICs) used in satellites, strategic missiles and other space vehicles. The two companies will jointly develop new ICs that will compute information faster, or at higher capacities, while withstanding the severe radiation environment in space.
Compass system designers have dynamic building blocks to create a tilt-compensated compasses with Honeywell's
HMC1055 3-Axis Compass Sensor Chipset
. We combine the popular HMC1051Z and HMC1052 magnetoresistive sensors with the D2010 dual-axis Memsic accelerometer into a single kit. This combination enables compass designers the option to choose the digital control methods and analog mplification to best fit the system priorities such as accuracy, resolution, size, and power consumption.
The
HX3000 ASIC family
of standard cell and gate arrays provides up to 2.2 million usable gates! The familyof ASICs utilize Honeywell’s radiation hardened 0.35 mm Silicon-On-Insulator (SOI) RICMOS™V technology. In addition to radiation hardness, the SOI technology provides high speed (>300 MHz) and low power (2.5V or 3.3V core with 5V compatible I/O) compared to conventional bulk CMOS processes. A variety of I/O and core cells including RAM (available on gate arrays as well as standard cell ASICs) are available to facilitate “System on a Chip”
New HMR3100 Digital Compass Now Available
. Introducing the HMR3100 Digital Compass, a two-axis electronic compass circuit board that can be easily and inexpensively integrated into new or existing navigation applications. With this addition to its magnetic sensor product family, Honeywell provides users several complete turnkey solutions for electronic compassing.
The
HMX2000 Mixed Signal ASIC family
of arrays incorporates analog functions as an extension of the available HX2000 Gate Array family, fabricated on Honeywell’s radiation hardened 0.8 mm Silicon-On-Insulator (SOI) RICMOS™ IV technology. The SOI IV process has performance advantages over bulk CMOS of 25-35% higher speed and up to 30% lower power. The SOI substrate can provide a 6X improvement in noise margins and significantly reduce leakage current.
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